Welcome to the 26th AMC

A workshop-atmosphere conference, featuring the latest R&D and manufacturing results as well as "real-world" integration and reliability data on the application of metallization and related technologies for advanced IC devices

The UC Berkeley Extension Advanced Metallization Conference (AMC) will be held October 13–15, 2009, in Baltimore, Maryland.

Conference Location
Baltimore, MD

Abstract Deadline Extended: July 10, 2009
Later submissions will be considered on a case-by-case basis.

General information
The papers presented at the conference will be published by the Materials Research Society. In the past, the books resulting from this meeting have been very popular, and have found highest acceptance as information sources for advanced metallization.

For additional information, please contact:

UC Berkeley Extension, Engineering
1995 University Avenue, Suite 110
e-mail: amc@unex.berkeley.edu
phone: (510) 642-4151
fax: (510) 642-6027

This conference also presents ADMETA 2009: 19th Asian Session held in Tokyo, Japan.